The Detroit Rubber Group will meet for their final event of the year, Nov. 10, for its fall technical meeting at the 3M Automotive Innovation Center in Livonia, Mich. Price to attend is $120, or $50 for OEMs, and coffee and lunch will be provided. Proceeds support the DRG Scholarship Program, which awards high school graduates.
Speakers and topics to date include:
- "Process Efficiency through Mold Release, Application Techniques and Usage monitoring" by John Brennan, technical sales representative for tire and rubber at ChemTrend L.P.
- "Plasma treatment of elastomers using Openair-Plasma" by Tim Smith, chief technical officer at Plasmatreat North America Inc.
- "Compatibility of Elastomers with Dielectric e-Fluids in Immersive Thermal Management Systems" by Mark Nevitt, senior applications development chemist at Zeon Chemicals L.P.
- "Rubber Materials Through Benchmarking" by Lance Saylor, customer engagement manager at A2MAC1
- "Successfully transitioning from solvent-based to water-borne rubber to substrate bond agents" by Roger Cassell, principal investigator for DuPont Adhesives and Fluids
- "The Simulation & Validation of the Rubber Molding Processes" by Ken Cheng, application engineer at Moldex3D Northern America Inc.
- "Development of Silica Filled Military Track Pads" by Lucas Dos Santos, senior research associate at PPG, and Chris Tolliver, physical scientist with the U.S. Army DEVCOM GVSC.
To pre-register, contact [email protected]. For more information, contact David Clark at [email protected] or visit the Detroit Rubber Group Fall Technical Meeting website.