HACKENSACK, N.J.—Master Bond Inc. has released a new single component epoxy designed for glob top and chip coating applications.
The firm said in a news release that Supreme 3CCM-85 also can be used for encapsulation and bonding. The epoxy cures within two to three hours at 175-185°F, making it advantageous for use on heat sensitive components and substrates.
Supreme 3CCM-85 is a toughened adhesive system that bonds well to a variety of substrates, Master Bond said. The product is not premixed or frozen and has a long open time at room temperature. It's convenient to handle and store and can be easily applied manually or with an automated dispenser. The epoxy is available for use in syringes ranging from 10 cc to 30 cc and standard size containers.
For more information, visit masterbond.com.
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