MUNICH—Wacker A.G. has unveiled its pyrogenic silica grade designed for adjusting the flow properties of polar adhesive systems.
HDK H21 can be readily and efficiently incorporated into polar adhesive compounds, Wacker said. The product's rheological activity is high in epoxy, vinyl ester and polyurethane based adhesives, which allows customers to produce non-sag formulations for use in structural bonds in a variety of industries.
The pyrogenic silica is a white amorphous powder based on highly pure hyperpure silicon dioxide, Wacker said. The firm's laboratory experiments show that HDK H21 blends into an adhesive formulation significantly faster than other hydrophobic products.
The firm said HDK H21 is ideal for use as a rheological additive in high-strength industrial adhesives, such as those in automotive industry bonding applications, in chemical dowels for the construction industry and in bonds between the half shells of wind turbine rotor blades.
For more information, visit wacker.com.
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