CLEVELAND—PolyOne Corp. has rebranded its ElectriPlast material technology as Surround EMI/RFI Shielding Formulations.
The portfolio of conductive thermoplastic materials shields sensitive electronics from electromagnetic interference and radio frequency interference, according to a PolyOne release.
Surround long-fiber material, which weighs up to 60 percent less than aluminum or copper, is suited for housings for advanced driver assistance systems because of its capability to replace metal in shielding applications, PolyOne said.
The material minimizes cross talk between electronic components, and is easier to process than materials such as aluminum or copper, according to PolyOne. The injection moldable material is suitable for thinner wall housings, giving increased design freedom with complex shapes and smaller component housings. It is durable, non-corrosive for long-term usage, and customizable to application needs including pre-coloring.
PolyOne said Surround material is also well positioned for additional shielding applications including camera housings and connectors beyond the automotive market.