HACKENSAK, N.J.—Master Bond Inc. has introduced MasterSil 170 Gel, a solvent-free, transparent silicone product that is designed for situations where protection of sensitive electronics or optical components from thermal stresses is key. It is ideal for wire bonds, optical fibers, various chips, LEDs and resistors, according to the firm.
In a news release, Master Bond said that the water-resistant gel can withstand "the most rigorous and extreme thermal shock and cycling without cracking or exerting stress on to components or substrates," while also demonstrating low shrinkage upon curing, which can occur at temperatures as low as 75°F. Elevated temperatures, however, will speed cure time.
After curing, Master Bond said, the transparent gel can withstand temperatures ranging from -67°F to +392°F. It demonstrates a low exotherm upon cure, and is easy to dispense.
Exposure to air is not needed for crosslinking. MasterSil 170 Gel has a one-to-one mix ratio by weight.
MasterSil 170 Gel provides excellent flowability for potting and encapsulation applications, according to the company, which also noted that the product has a low mixed viscosity of 1,000 cps and a long working life after mixing (2-4 hours for 100 g batch).
"Optically," Master Bond said, "the index of refraction is low and it transmits light very well from about 220-2,500 nm. This silicone gel can also be used in other types of applications where a low stress highly pliable sealant is needed."