ROCKY HILL, Conn.—Henkel Adhesive Technologies has joined HP Inc.'s Open Materials and Applications Platform, and will work with HP to develop customized, industry-specific solutions for HP Multi Jet Fusion customers.
The work will take place at HP's 3D Materials and Applications lab in Corvallis, Ore.
Henkel engineers thermal and light cure acrylic, silicone, epoxy and polyurethane adhesives, sealants and coatings. Those products have applications in medical components, electronic devices and transportation vehicles.
"With our broad material portfolio and customer base across diverse industries, Henkel is able to champion custom 3D solutions through various functional applications. This, combined with HP's vision for open materials innovation, enables us to develop materials and applications once thought impossible," said Michael Todd, corporate vice president and global head of innovation and new business development for Henkel Adhesive Technologies.
Henkel's understanding of manufacturing process integration will help accelerate the transition of additive manufacturing to production settings.
"We look forward to working closely together in HP's new Open Materials and Applications Lab to certify materials for the HP Multi Jet Fusion 3D printing platform," said Stephen Nigro, president of 3D printing, HP Inc.