WESTLAKE, Ohio—Nordson Corp. and H. Moryl GmbH of Duesseldorf, Germany have reached a settlement regarding the German company's potential infringement of one of Nordson's patents, according to a news release.
Nordson has granted H. Moryl a "covenant not to sue" for past and future sales of hot melt adhesive modules under the patent, the release stated. Financial terms were not disclosed.
The patent, EP1568418, is in effect in France, Germany, Italy, Spain, Sweden, Switzerland and United Kingdom and relates to "hot melt adhesive modules, manifolds, and/or applicators having a proprietary mounting interface," according to the release.
This is part of an ongoing licensing program announced by director packaging Europe Ulrich Bender to offer these kinds of covenants or licenses for products under the patent.