TORRINGTON, Conn.—Dymax Corp. has been awarded a new patent from the U.S. Patent and Trademark Office.
Dymax received U.S. Patent No. 9,394,436 for a method of preparing a flexible, substantially tack free gasket by forming a liquid composition that would enclose displays, electronic circuits and similar components.
The firm said in a Sept. 21 news release that the composition is distributed onto a substrate and then exposed to actinic radiation to cure the liquid composition into a flexible, substantially tack free gasket having a Shore A hardness range of A20 to A80. Resins formulated with this formula can be dispensed into intricate and complex configurations with the added benefit of curing inline, which Dymax says allows for increased production speed and reduced inventories.