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August 13, 2015 02:00 AM

Dow Corning earns award for conductive gel

Rubber & Plastics News Report
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    MIDLAND, Mich.—Dow Corning Corp. has garnered a 2015 3D InCites Award for its Dow Corning TC-3040 thermally conductive gel, a silicone-based thermal interface material (TIM 1) designed to manage heat and support reliable performance for advanced semiconductor flip chip applications.

    According to Dow Corning, award winners were selected by a panel of 12 judges from industry, academia and the technical community. Dow Corning TC-3040 thermally conductive gel won the top award in the 3D Materials category.

    Members of the Dow Corning team accepted the award at SEMICON West 2015 in San Francisco in July. Proceeds from the event go to support STEM-related educational programs and scholarships.

    “Advanced flip chip packaging applications have put intense pressure on integrated circuit chipmakers to find new and better ways to manage potentially damaging heat in these devices, and Dow Corning is proactively developing solutions to help customers meet these challenges today and in the years ahead,” Andrew Ho, global market segment leader at Dow Corning, said in a news release.

    A one-part silicone technology, Dow Corning said its TC-3040 thermally conductive gel's heat management capabilities deliver nearly two times the thermal performance of other industry standard TIMs, and enable it to regulate the harsh, high-temperature extremes in semiconductor packages. Additionally, it features a combination of low modulus and high elongation, which prevents warpage and delamination, the company said. Dow Corning also claims it provides good wetting for excellent interfacial contact between the chip and lid, and can accommodate high filler loadings for enhanced thermal performance.

    Dow Corning TC-3040 gel is compatible with standard substrates, lids, heat sinks and other flip chip-related materials, Dow Corning said, while offering flexible cure options, including the ability to cure at low temperatures. It can be easily applied to achieve thin bond lines and provides excellent under-die coverage.

    The 3D InCites Awards program recognizes achievements to further the commercialization of 3D integration technologies. Awards are presented to companies whose innovative products have contributed to the advancement of innovative processes that enable interposer integration, 3D ICs, monolithic 3D, 3D memory and 3D heterogeneous integration.

    In 2015, 3D InCites Awards were presented in devices, design tools, materials, manufacturing equipment and inspection/metrology tools.

     

     

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