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Dow Corning Corp. has introduced its TC-4525 Thermally Conductive Gap Filler to meet fast-growing global demand for improved processability and thermal management in automotive electronics applications. Dow Corning TC-4525 Thermally Conductive Gap Filler is available worldwide, the company said.
This high-performing silicone technology delivers thermal conductivity of 2.5W/m.K, Dow Corning said, greatly improved dispensability, significantly reduced abrasiveness and stable performance for more reliable electronics in harsh automotive underhood environments.
TC-4525 is a soft, compressible, two-part silicone that can be dispensed directly from its original packaging with minimal to no additional process preparation, which makes it well-suited for automated dispensing using standard meter mix equipment. The company claims that its thixotropic properties enable it to dispense easily, avoid slumping on vertical surfaces during assembly and—after cure—maintain its vertical stability even after long use.
Dow Corning said this advanced product platform includes an optional formulation that incorporates glass beads to control bond line thickness during assembly. Precise formulation of the thermally conductive filler enables this material to deliver much lower abrasiveness to lower friction and help reduce maintenance.
To learn more about Dow Corning's advanced silicone technologies for thermal management and other applications, go here.